Electrodeposition of copper-indium alloy under diffusion-limiting current control

P.P. Prosini, M.L. Addonizio, A. Antonaia, S. Loreti

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Abstract

The aim of this work was to study a method of electrodeposition of stoichiometric copper-indium alloy to be used as a precursor for obtaining CuInSe2by selenization. This compound represents one of the most promising materials in terms of low cost and high efficiency for the realization of large-area thin film solar cells for terrestrial applications. However, to avoid the growth of secondary phases such as CuSe and In2Se3, the stoichiometry and morphology of the alloy have to be carefully controlled. We investigated the relationship between the ratio of Cu2+to In3+in the solution and the metal ratio in the deposited film. In order to avoid the use of complexing agents we chose to control the stoichiometry of the copper-indium alloys, electrodepositing them under diffusion-limiting current. Since the diffusion currents are, as a first approximation, proportional to the concentrations, there is a simple relationship between the individual diffusion currents of the ions and the stoichiometry of the deposited alloy. Thus we can change the Cu-In content in the deposited film by controlling the ratio between the ions in the deposition bath.
Original languageEnglish
Pages (from-to)90 - 94
Number of pages5
JournalThin Solid Films
Volume288
Issue number1-2
DOIs
Publication statusPublished - 15 Nov 1996

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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