Highly textured multi-crystalline silicon surface obtained by dry etching multi-step process

L. Cecchetto, L. Serenelli, G. Agarwal, M. Izzi, E. Salza, M. Tucci

Research output: Contribution to journalArticle

9 Citations (Scopus)


In this work we propose the use of a plasma dry etching technique to condition the morphology of a silicon surface. The low environmental impacted NF3halogen compound is adopted together with Ar to perform a multi-step process which helps to enhance the silicon surface texturing, thus reducing the time needed for the whole dry etching procedure, which also include saw damage removal on silicon wafers. A detailed study of surface reflectance and etching rate as a function of the dry plasma process parameters is discussed to achieve suitable multi-crystalline silicon surfaces for photovoltaic applications. © 2013 Elsevier B.V.
Original languageEnglish
Pages (from-to)283 - 290
Number of pages8
JournalSolar Energy Materials and Solar Cells
Publication statusPublished - 2013


All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films

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