Investigation of Soldered REBCO Tape-Copper Joints for Superconducting Applications

Nadezda Bagrets, Giuseppe Celentano, Andrea Augieri, Rainer Nast, Klaus-Peter Weiss

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6 Citations (Scopus)

Abstract

In the growing field of higherature superconductor (HTS) applications, soldered tape-copper joints are of significant importance. This is because the resistance of the joint often plays a decisive role in the design of a superconducting device, such as current leads or current terminations of cables. A common requirement to the joint is as-low-as-possible resistance and reliable reproducibility, which is crucial for achieving a homogeneous current distribution being independent within each HTS tape placed in a superconducting device. From previous studies, it is known that resistance of HTS tape-copper joint can vary for different tapes and solders. This resistance can be considered as a sum of several contributions: REBCO-layer-copper-laminating-layer interface resistance in HTS tape, copper-laminating-layer-solder and solder-copper interface resistances, and solder and copper resistances. Here, we present current status of investigations on tape-copper joints and trials to estimate different contributions in their resistance value.
Original languageEnglish
Article number7414426
Pages (from-to)-
JournalIEEE Transactions on Applied Superconductivity
Volume26
Issue number4
DOIs
Publication statusPublished - 1 Jun 2016
Externally publishedYes

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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