Localized metal plating on aluminum back side PV cells

M. Balucani, K. Kholostov, L. Serenelli, M. Izzi, D. Bernardi, M. Tucci

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

In this work we demonstrate a new selective metallization technique to perform localized plating on the screen-printed Al contact using the innovative approach based on Dynamic Liquid Drop/Meniscus that is able to touch the cell back contact in specific defined positions and show that it is possible to produce suitable electrical and mechanical contact with Al-Si and thus to replace the silver from the back contact in the cell manufacturing process reducing the solar cell cost. A fast pre-treatment process was developed to clean and prepare the surface of the aluminum on the back side of PV cells allowing direct plating with good electrical contact. Several commercial aluminum screen printable pastes have been experimented also having different distribution of sphere particles dimensions. We have used high resolution Scanning Electron Microscopy (SEM) and compositional microanalysis with Energy Dispersive X-Ray microanalysis (EDX) to evaluate the metal dispersion within aluminum-silicon inter-diffused region and Transfer Length Method and current-voltage measurements to estimate the specific contact resistivity of the metal contact and series resistance of the overall solar cell device. We have found that the interconnection ribbon soldered on tin contacts plated on screen printed aluminum back contact shows adhesion higher (> 1N/mm) than that verified on screen printed silver over silicon. The main difference between a tin pad and a nickel-tin pad will be shown. Efficiency increase and fill factor are compared respect standard Al-Ag back contact PV cell.
Original languageEnglish
DOIs
Publication statusPublished - 11 Sep 2014
Event64th Electronic Components and Technology Conference, ECTC 2014 - Orlando, United States
Duration: 11 Sep 2014 → …

Conference

Conference64th Electronic Components and Technology Conference, ECTC 2014
CountryUnited States
CityOrlando
Period11/9/14 → …

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Balucani, M., Kholostov, K., Serenelli, L., Izzi, M., Bernardi, D., & Tucci, M. (2014). Localized metal plating on aluminum back side PV cells. Paper presented at 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, United States. https://doi.org/10.1109/ECTC.2014.6897550