Ni-Cu-Co biaxially textured substrates for YBCO tape fabrication

Gy. Thalmaier, I. Vida-Simiti, A. Rufoloni, G. Celentano, A. Vannozzi, A. Angrisani, T. Petrisor

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Abstract

One of the most promising techniques for high Jc YBa 2Cu3O7-x (YBCO) tape fabrication is the deposition of superconducting thick film on a biaxially oriented metallic substrate. Until now, Ni has been the most used substrate. The ferromagnetic behavior and the low strength after recrystallization represent the main drawback of the Ni substrates. This paper presents the magnetic and structural properties of a new metallic substrate based on Ni50Cu50 solid solution. The role of copper is to decrease the Curie temperature of Ni and, as a consequence, to reduce the ac losses in the substrate. The Curie temperature linearly decreases with copper concentration, reaching the zero value for about 65 at % Cu. In order to increase the strength, the Ni 50Cu50 was alloyed with 3at. %Co. The (100)[001] cube texture was induced in (Ni50Cu50)97Co 3 solid solution by cold rolling processing followed by a recrystallization thermal treatment at 900 °C for 4 hours in high vacuum (10-7 Torr). The as obtained tapes exhibit a sharp, well developed cube texture with the FWHM of ω-scans of 6°, respectively. The scanning electron microscope (SEM) analyses have revealed that the tapes exhibit a good morphology appropriate for the epitaxial deposition of buffer layer and of the YBCO film.
Original languageEnglish
Pages (from-to)913 - 915
Number of pages3
JournalJournal of Optoelectronics and Advanced Materials
Volume10
Issue number4
Publication statusPublished - Apr 2008
Externally publishedYes

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All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Physics and Astronomy (miscellaneous)

Cite this

Thalmaier, G., Vida-Simiti, I., Rufoloni, A., Celentano, G., Vannozzi, A., Angrisani, A., & Petrisor, T. (2008). Ni-Cu-Co biaxially textured substrates for YBCO tape fabrication. Journal of Optoelectronics and Advanced Materials, 10(4), 913 - 915.